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Gold Wire Bonding Induced Peeling in Cu/Low-k Interconnects: 3D Simulation and Correlations.
PDF) Conception and optimization of new architecture for high performance organic field effect transistors
The Role of a Physical Analysis Laboratory in a 300 mm IC Development and Manufacturing Centre
RECENT DEVELOPMENTS ON 3D INTEGRATION OF METALLIC SET ONTO CMOS PROCESS FOR MEMORY APPLICATION
Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics
STMICROELECTRONICS SA Crolles (Crolles, Auvergne-Rhône-Alpes)
Contrôle technique CONTROLE TECHNIQUE DE CROLLES (CTC) - Dekra-Norisko.fr
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Ultrahigh-responsivity waveguide-coupled optical power monitor for Si photonic circuits operating at near-infrared wavelengths | Nature Communications
Study of MOSFET Low Frequency Noise Source Fluctuation Using a New Fully Programmable Test Set‐up
Advanced Surface Cleaning Strategy for 65nm CMOS Device Performance Enhancement | Scientific.Net
STMICROELECTRONICS - 850 Rue Jean Monnet, Crolles, Isère, France - Yelp
PDF) New techniques to characterize properties of advanced dielectric barriers for sub-65nm technology node | M. Veillerot - Academia.edu
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Crolles - Wikipedia
Assessment and Characterization of Stress Induced by Via-First TSV Technology
Crolles 1 et Crolles 2
Ultrahigh-sensitivity optical power monitor for Si photonic circuits
Process Transferability from a Spot Beam to a Ribbon Beam Implanter: CMOS Device Matching
Crolles 1 et Crolles 2
STMICROELECTRONICS (CROLLES 2) SAS (CROLLES) Chiffre d'affaires, résultat, bilans sur SOCIETE.COM - 399395581
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Numerical Analysis of the Reliability of Cu/low-k Bond Pad Interconnections Under Wire Pull Test: Application of a 3D Energy Bas
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Tensile-strained germanium microdisks with circular Bragg reflectors
STMicroelectronics - La French Fab
Effects of plasma and wet processes on Si-rich anti- reflective coating to address selective trilayer rework for sub-20nm techno
Evaluation for Intra-Word Faults in Word-Oriented RAMs
Electron BackScattered Diffraction (EBSD) use and applications in newest technologies development
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